Amkor Technology, Inc. is one of the world's largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor has become a strategic manufacturing partner for hundreds of the world's leading semiconductor companies and electronics OEMs, providing a broad range of advanced package design, assembly and test solutions.

Amkor's operational base encompasses more than 5 million square feet of manufacturing facilities, product development centers, and sales & support offices in Asia, Europe and the United States. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. Our design center offers best-in-class thermal, electrical and mechanical modeling and characterization, design automation, and support of DFM (design for manufacturing) and customer DFC (design for cost). Amkor’s test engineering services span the scope of test program development to full product characterization for the packaging of RF, mixed signal, logic and memory devices.

The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor ‘s packaging formats include wafer level, chip scale, ball grid array, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®) technology, and wafer level fan-out (WLFO). 3D configurations such as Package-on-Package (PoP), stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Furthermore, Amkor continues to improve mature package technologies with the application of new materials and processes. Amkor’s recently introduced pin-gate molded PBGA pushes wire bonding down to 28nm while providing superior quality, reliability, and performance at even higher yields and reduced cost.

Amkor Technology is a proud member of IMAPS since 1994 and a sponsor of the IMAPS Global Business Council. Lee Smith, VP Amkor Business Development and Marketing, also serves as IMAPS VP of Membership. For more information on Amkor Technology, visit http://www.amkor.com.

NTK Technologies in forefront of ceramic and organic packaging.
For nearly half a century, NTK has developed specialized technologies to provide advanced ceramic IC packaging solutions for IDM and fabless semiconductor companies. NTK’s products and services have evolved to match the roadmaps of both complex ceramic and large scale organic applications. NTK’s products are integrated in the entire array of semiconductor applications including computing, consumer, optical, wireless, medial, automotive, and space.

As a total package manufacturer, NTK Technologies offers a rich array of products using organic, HTCC, LTCC and other materials including: IC packages for MPUs, ASIC/FPGA, Communication, Automotive Parts, Saw/Crystal Filters for Cellular Telephones, and Dielectric Resonators for Base Stations. NTK’s Space Transformers are a central part of the hardware test strategy.

NTK’s Sales and Design Centers and Production Facilities are positioned to facilitate close proximity to customers. The design centers offer design support for optimal package designs with access to thermal and electrical package optimization as well as full wave electromagnetic field simulation.

For more information on NTK technologies, visit http://www.ntktech.com.

IMAPS is fortunate to have good participation from Rich Rice and other staff at the Advanced Semiconductor Engineering, Inc. (ASE). Rich recently served well as the co-chair of the 2011 Spring Conference of the IMAPS Global Business Council. IMAPS looks forward to future event participation with and promotions for the company at IMAPS 2011.

ASE Inc. is the world’s largest independent providers of semiconductor packaging and test services. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, ASE Inc. develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and design manufacturing services.

See more on ASE at their website - http://www.aseglobal.com/content/1-9.htm.

Kyocera America, Inc. (KAI) has been manufacturing ceramic packages in San Diego, CA since 1971. KAI offers an extensive array of semiconductor packages and complex modules for numerous applications including RF, millimeter wave, high-reliability, phased array radar, and telecommunications. Packages are available in HTCC, LTCC, alumina, and BeO. KAI has state-of-the-art package design capability in-house that includes electrical and thermo-mechanical design, modeling / simulation and analysis to maximize package and circuit performance in your application. Our Assembly Technology Division accepts prototype to volume production orders for flip chip, wirebond, wafer dicing and vacuum soldering to provide a convenient one-stop-shop solution for customers.

The Electronics Group of Crane Aerospace & Electronics designs and manufactures high-density, high-reliability electronics for aerospace, space, military, medical, industrial and commercial applications. Product and service offerings are organized in solution sets, and include Power Solutions, Microwave Systems Solutions and Microelectronics Solutions.

Our Microelectronics Solutions miniaturizes electronics to reduce weight and size with increased reliability. We provide advanced miniaturization and packaging services from the beginning of the product development cycle into full volume production and beyond.  Our solution features capabilities such as surface mount, chip & wire, die stacking, chip scale packaging (CSP) and gold stud bumping. 

At Crane, our products are manufactured under the brand names Interpoint, ELDEC, and Signal Technology.  For more information on Crane Aerospace and Electronics, visit www.craneae.com and for Crane Co., visit www.craneco.com. 

Tessera Technologies, Inc., invests in, licenses and delivers innovative miniaturization technologies that transform next-generation electronic devices. The company’s micro-electronics solutions enable smaller, higher-functionality devices through chip-scale, 3D and wafer-level packaging technology, as well as high-density substrate and silent air cooling technology.

In the early 1990s, Tessera’s founders invented fundamental packaging technology which is now widely used throughout the semiconductor industry. The company’s innovations include its visionary μBGA® solution, the ground-breaking chip-scale packaging CSP technology, which incorporates the Tessera Compliant Chip (TCC) technology. The µBGA CSP family enables a very short electrical path between the die and the module or printed circuit board (PCB), which allows the package to deliver performance that meets the requirements of memory such as high-performance DRAM.

Tessera continues to innovate and expand upon these technologies. The company’s µPILR™ solution is an advanced packaging solution designed to overcome technical limitations of interconnect, packaging and substrate technologies such as pitch, profile, performance, reliability and test capacity. Tessera’s extensive research and development efforts focus on electronic product miniaturization from a system perspective, specifically through the dense interconnection of components and extensive use of three-dimensional and advanced substrate packaging technologies.

For more information, visit www.tessera.com.

Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, display, photovoltaic, LED and optics markets. From advanced technology centers worldwide, teams of talented Dow research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation electronics. These partnerships energize Dow’s power to invent.

Dow’s portfolio includes: CMP, lithography, metallization and ceramic materials for semiconductor applications; surface preparation, metallization and imaging materials for interconnect, electronic and industrial finishing, and photovoltaic applications; precursor materials for LED, solar and semiconductor manufacturing; and zinc-based materials for optics.

For advanced semiconductor packaging, Dow Electronic Materials provides innovative materials that enable the latest schemes in production and in development, including wafer level chip scale packaging (WLCSP), flip chip, multi-functional system-in packages (SiP), and 3D chip packages. Product offerings include lithography materials for semiconductor packaging, including spin-on photodielectrics, photoresists and associated ancillaries, and a broad set of metallization products. These materials have a wide range of uses in packaging applications, such as copper pillar, through-silicon via (TSV), wafer bumping, trench and via filling, redistribution and under-bump metallization (UBM). Environmentally-friendly, lead-free options are available.

Dow Electronic Materials
455 Forest Street | Marlborough, MA 01752 | Tel: 508-481-7950 | Fax: 508-485-9113
Email: PFTInfo@rohmhaas.com | Web: www.rohmhaas.com

Established in 1984, STS is a leading manufacturer of cassette-to-cassette cluster and single/batch loadlocked plasma etch and deposition systems that can be configured with ICP, XeF2 and PECVD sources.

STS products include the market-leading ASE® deep silicon etch process (also known as Deep Reactive Ion Etch or DRIE) for dry, anisotropic, high aspect ratio etching.  This process has been used for over 10 years in MEMS manufacturing and is now a key enabling technology for etching through silicon via (TSV) interconnects for emerging 3D-IC applications.

STS' process technologies are available on a range of platforms which give a logical upgrade path from R&D and pilot production to volume production, without the need for process re-qualification.

STS and their parent company Sumitomo Precision Products Co., Ltd (SPP) operate two manufacturing sites in the UK and Japan, and have Regional Sales/Service Offices in California, Singapore and Taiwan supported by an established network of experienced local agents throughout Europe, USA and Asia.

For more details, see http://www.stsystems.com