2008 - Volume 5
Number 3 - Third Issue 2008
Welcome to the newest Associate Editor, Dr. Yanhong Tian, from the Harbin Institute of Technology in Harbin, China.
Number 2 - Second Issue 2008
Welcome to the newest member of the Editorial Board, Jens Müller, Ph.D., from the Ilmenau University of Technology in Germany.
Number 1 - First Issue 2008
With this 1st quarter 2008 issue, you will notice a comprehensive change in the formatting and style from what we have published in the past. We hope that you will find this format both pleasing to the eye and more pleasant to read.
2007 - Volume 4
Number 4 - Fourth Issue 2007
This issue features a Special Section on Packaging for Extreme Cold Environments with a Guest Editorial from Rajeshuni Ramesham of NASA's Jet Propulsion Laboratory. This Fourth Issue also includes three invited papers from the CICMT 2007 Conference as well as 1 regular contribution addressing Global-to-Local Modeling and Experiment Investigation of HFCBGA Board-Level Solder Joint Reliability.
Number 3 - Third Issue 2007
Featuring three invited papers from the CICMT 2007 Conference as well as 3 regular contributions addressing High Temperature Spin-on Adhesives..., Failure Analysis of Lead-Free Solder Joints..., and Design and Optimization of Piezoelectric Fans.
Number 2 - Second Issue 2007
Featuring one invited paper from IMAPS 2006, two invited papers from the CICMT 2007 Conference as well as 3 regular contributions addressing RGA Correlation, Lead-Free Solder Joints, and High Reliability Via.
Number 1 - First Issue, 2007
Featuring 6 regular contributions addressing Chip-to-Chip Communications,Epoxies, MEMS Devices for Biological Environments, Thermal Characterization of Stacked Multichip Package, LTCC, and PWB Warpage.
2006 - Volume 3
Number 4 - Fourth Issue, 2006
Featuring two invited papers from the CICMT 2006 Conference as well as 5 regular contributions addressing thermal issues, power loss, 3D packaging, thin films and FCBGA packages.
Number 3 - Third Issue, 2006
Welcome to the third quarterly issue of 2006.
Regular readers will notice a different Editor's name with this issue. Former Editor-in-Chief, Doug Bokil, relinquished the reins to focus on other priorities. I would like to welcome Fred Barlow as the new editor-in-chief of the JMEP. Dr. Barlow is currently an Associate Professor of Electrical Engineering at the University of Idaho and has been an active member of IMAPS since 1991. This change will take effect for the 4th quarter issue of 2006, and I trust that you will be pleased with the quality and content of future issues of the journal.
Number
2 - Second Issue, 2006
Welcome
to the second issue of year 2006. This
issue consists of two sections; the first one contains
five papers that were submitted directly and the second
section contains one paper from the IMAPS Poland-2005 symposium.
As is our policy all papers were reviewed by members of
our Advisory Board.
Number
1 - First Issue, 2006
Welcome
to the first quarterly issue of year 2006. This
issue consists of two sections; the first one contains
two papers from IMAPS-2005 that were awarded "Best
Paper" classification, and the second section contains
four papers from the IMAPS-Bruges-2005, Belgium, symposium.
As is our policy all papers were reviewed by members of
our Advisory Board.
2005 -
Volume 2
Number 4 - Fourth Issue, 2005
Welcome
to the fourth quarterly issue of year 2005.
It
is difficult for me to imagine that I have had the
fabulous challenge and opportunity of being the EIC
of JMEP for the past two years - time flies when you
are having fun!
It is our pleasure to introduce to you three new Associate Editors who have
joined our Editorial board. (1) Prof. K N Seetharamu, M S Ramaiah School of
Advance Studies, Bangalore, India, (2) Dr. Andrzej Dziedzic, Wroclaw University
of Technology, Poland and (3) Mr. Ziliang Wang, Professor of Electronics Packaging
with Nanjing Electronic Devices Institute, PRC.
In
this issue we have two issues on MEMS applications,
one on thermal analysis, and one on non-destructive
testing, two on general aspects of plastic packaging
and one that revisits Au-Sn intermetallic - something
that I first encountered when we were developing Au
thermo-sonic wire bonding at RCA during the late 1970s!...
Number 3 - Third
Issue, 2005
The
JMEP has become global in character, in the sense that
the authors contributing papers to the JMEP are now from
many countries around our globe as shown below in alphabetical
order:
Australia,
Austria, Belgium, Canada, Finland, Germany, Hong Kong,
India, Ireland, Italy, Japan, Malaysia, Netherlands,
P.R. China, Poland, Singapore, Spain, Taiwan and USA.
In
keeping with this aspect of globalization our referees
are now from the USA, UK and Singapore. Shortly, we
plan to add referees from Europe, Japan, India and
other countries...
Number
2 - Second Issue, 2005
Thermal management
issues continue to motivate us to design better heat-sinks.
Papers one through three offer several possible solutions
to designing heat-sinks for ever shrinking sizes
of electronic products. Paper four deals with the
thermal stresses faced by bimaterial structures.
Rapid
curing of polymer dielectrics using microwave processing
is covered in paper five. In paper six,
photoimageable thick film inks are used to print
line widths of 30 µm and spaces of 100 µm
- that is progress.
Number
1 - First Issue, 2005
Welcome to
the first issue of year 2005. In this issue, in addition
to the "Regular Contributors" and "Best
Paper - IMAPS Symposia", we have the privilege
of adding a separate section for the "Best Paper
- 28th International Conference, IMAPS Poland".
This issue echoes and exemplifies what Bruce Romenesko,
the
current IMAPS President, has written in Advancing Microelectronics, "A
word is in order about our increasingly intertwined society".
2004 -
Volume 1
Number
4 -- Fourth Issue, 2004
Happy Holidays! This issue covers
transfer molding, laser processing, RF IC processing,
high temperature components, power microelectronics,
BGA and CSP packages, and thermal analysis.
Number
3 -- Third Issue, 2004 - ISSN
Now Available
Seven of the nine papers cover
a wide spectrum of cooling techniques, processing
temperatures, etc. Starting
with this issue we are reintroducing a section titled "Invited
Manuscript (Best Paper – IMAPS
Symposia)" highlighting papers that have earned "Best
of Symposium" or "Best of Session" awards
at a recent IMAPS symposium.
Number
2 -- Second Issue, 2004
This issue covers topics from BCB
to CSP, to thermal effects, to CBGA and sensors.
What would
we do without
acronyms?!
Number
1 -- First Issue, 2004
Addresses
the important and critical thermal characteristics
that are associated
with the design, testing and evaluation
of microelectronics packaging.
View
the archives of IMAPS past International Journal
of Microcircuits and Electronic Packaging
