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Bringing Together the Entire
Microelectronics Supply Chain...
For
each IMAPS technical event you will see a pyramid unique
to
the event to better help you understand how to participate
and what involvement to expect from each level of the respective
industry supply chain. With the rapid globalization of world
economies and markets, many electronics companies are now
outsourcing many of their manufacturing steps to subcontractors
around
the world. Both the technical and business people realize
they must look at their product and manufacturing processes
with
a broader perspective. IMAPS facilitates this discussion
by organizing its technical programs to match this 4- tiered
global
supply chain model. Communications among all 4 tiers of the
microelectronics and packaging supply chain are critical
to the success of innovation and new product developments.
The
IMAPS International Symposium, as well as the many workshops
and topical conferences held throughout the year, are being
structured to include presentations in all four of these
categories. The IMAPS PYRAMID depicts these 4 tiers and
the interrelations
between each.

Typically, the
vision and ideas for end products and technology needs
initiate at the INDUSTRY level. RF/Wireless, Biomedical,
Military and other end user areas constitute the industry
level. The next tier, which enables the electronic functioning
of these products, is the SYSTEMS & APPLICATIONS tier.
The microelectronic product design for mobile phones, automotive
engine managements systems, defibrillators, and other end-
user products start here. The next tier is DESIGN. This level
brings together the desire of the product concept with the
reality of how the microelectronic subsystems and components
get laid out, designed, simulated and integrated into packages
and subsystems. Last, the MATERIALS & PROCESS tier supplies
individual component and material technology to the SYSTEMS
in order to specify and build the end product.
IMAPS addresses everything in electronics between the chip and the system across 10 primary industries and their related supply chains. The table below illustrates examples of all of the technologies that are represented by IMAPS at each level of the supply chain.
| Industry |
Systems & Applications |
Design |
Materials & Process |
| Automotive |
• Power/Hybrid Modules
• Powertrain Control
• Collision Avoidance and Safety
• X-by-Wire
• Driver Comfort/ Information/Audio Systems
• Telematics |
• Thermal and Power Management
• RF/Wireless/mmWave/ RADAR/LIDAR/IR
• Harsh Environment
• MEMS and Sensors
• High Performance Interconnects
• Systems on Chip |
• Thermal and Power Packaging
• Sensor and MEMS Packaging
• Advanced Interconnects, Connectors and Wirebonding
• Ceramic Substrates and Ceramic Technologies
• High Density and High Performance Organic Substrates
• Underfill/Encapsulants and Adhesives
• Solder Materials, Processes, and Reliability
• Flip-Chip and Bumping: Processes, Reliability
• LED Packaging
• Embedded and Integrated Passives
• Green Packaging/Compliance with RoHS |
| Biomedical |
• Implantable
• Imaging and Optics
• Biosensors
• MEMS/NEMS
• Nano Technology
• Hearing/Vision Aids
• Neurological Devices
• Cardiovascular Diagnostics
• Disposable Electronics
• Biometric Identification |
• Power Management
• Wireless/RF Telemetry
• Microfluidics
• Environmental Constraints for Medical Products
• EMI
• Thermal |
• Biocompatible Materials
• Reliability Assessments
• Qualification Approaches
• RoHS Compliance
• Regulations
• Outsourcing Issues
• Flipchip
• LTCC
• Wirebonding
• Substrates |
| Communications |
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| Consumer Electronics |
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| Energy |
• Solar Energy (Photovoltaics)
• BioFuels and Energy from Waste
• Fuel Cells
• Wind Energy
• Batteries and Hybrids |
• Thermal and Power Management
• Environmental Regulations
• Design for Efficiency |
• Materials & Reliability Qualification Approaches
• RoHS Compliance & Regulations
• Outsourcing Issues
• Government Policies |
| Military, Aerospace, Space and Homeland Security |
• Space Systems
• Homeland Security Systems
• Microwave Systems
• High Speed Digital Systems
• Communication Systems
• Vision Systems
• Energy Systems |
• Mobile Military Electronics
• Display Modules
• Filters
• Antenna
• Transmitters/ Receivers
• High Speed Digital Design
• Energy Sources
• Sensors
• Biometric Access
• Smart Cards |
• 3D Packaging and High Density Substrates
• Sensor and MEMS Packaging
• Underfill/Encapsulants and Adhesives
• Pb-free Solder Materials
• Flip-Chip and Bumping Technologies
• Fuel-Cell Packaging
• Packaging for Extreme Environments
• Advanced Interconnects and Wirebonding
• Embedded and Integrated Passives
• Advanced Ceramic and Conductive Materials
• Cu/Low-K
• Reliability |
| Optoelectronics |
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| Sensors |
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| Testing, Simulation and Analysis |
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